Alumni

Dr. Nicolas Aimon, naimo@alum.mit.edu

Dr. Karim Aissou, Institut Europeen des Membranes, Montpellier, France,  karim.aissou@umontpellier.fr

Prof. Wubin Bai, University of North Carolina, wbai@unc.edu

Prof. Lei Bi, University of Electronic Science and Technology of China, Chengdu, bilei@uestc.edu.cn

Dr. Martin Bolduc, Varitron, Quebec, mbolduc@varitron.com

Dr. Fernando Castaño, ams OSRAM, Austria, fernando.castano@ams.com

Peter Chambers, U. Pittsburgh

Xiaoyan (Cherie) Chen, xychen@alum.mit.edu

Dr. Joy Cheng, TSMC, Taiwan, yrchengb@tsmc.com

Dr. Li Chen Cheng, Lam Research, li-chen.cheng@lamresearch.com

Prof. Hong Kyoon Choi, Kongju Univ., Korea, hkchoi@kongju.ac.edu

Dr. Vivian Chuang, JSR Micro Inc, CA

Irénée Colin, irenee@alum.mit.edu

Dr. Saman Safari Dinachali, safarid@alum.mit.edu

Lei Du

Prof. Takian Fakhrul, Bangladesh University of Engineering and Technology, takianf@mme.buet.ac.bd

Dr. Yabin Fan, Western Digital, CA, yabinfan@wdc.com

Dr. Maya Farhoud, Qorvo Inc., Marin, CA.  

Lexi Ford, UC Berkeley

Dr. Elizabeth Friend, Western Digital, CA

Prof. Carlos Garcia, Universidad Tecnica Federico Santa Maria, Chile, carlos.garcia@usm.cl

Prof. Taichi Goto, Tohoku University, Japan, taichi.goto.a6@tohoku.ac.jp

Dr. Kevin Gotrik, 3M Corp., kwgotrik@mmm.com

Dr. Adam Floyd Hannon, Data Scientist, FraudScope, thefloyd@alum.mit.edu  

Prof. Yaowu Hao, University of Texas at Arlington, yhao@uta.edu

Susumu Haratani, TDK Japan, shara@mb1.tdk.co.jp

Dr. Pin Ho, Senior Scientist, A*STAR – Agency for Science, Technology and Research, Singapore

Prof. Minha Hwang, Principal Architect, Microsoft, CA

Dr. Filip Ilievski, Technologist, Apple, CA, filip@alum.mit.edu

Prof. Jean Anne Currivan Incorvia, University of Texas Austin, incorvia@austin.utexas.edu

Dr. Youngman Jang, Samsung, S. Korea, youngman.jang@samsung.com

Dr. Peng Jiang, peng0469@alum.mit.edu

Dr. Wonjoon Jung, Western Digital, CA, jungwonjoon@westerndigital.com

Prof. Yeon Sik Jung, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, ysjung@kaist.ac.kr

Dr. Christine Kathrein, Univ. Aachen

Prof. Dong Hun Kim, Myong Ji University, Korea. dhkim@mju.ac.kr

Prof. Hyunsuk Kim, Department of Materials Science and Engineering, ChungNam National University, Korea, khs3297@cnu.ac.kr

Dr. Jin Young Kim, Korean Institute of Science and Technology, S. Korea, jinykim@kist.re.kr

Dr. Enno Lage, Signaturexperte Magnetik, Thyssenkrupp, Kiel, Germany

Katharina Lasinger, ETH Zurich, lasingek@mit.edu

Keehong Lee, Samsung Semiconductor R&D Center, power710.lee@samsung.com

Dr. Sangho Lee, Massachusetts Institute of Technology, sholee@mit.edu

Wonmoo Lee, KAIST, Korea, wontauk1526@kaist.ac.kr

Wang Lei, soyegg@alum.mit.edu

Dr. Frank Liu, IBM, frankliu@us.ibm.com

Dr. Runze Liu, runzeliu@alum.mit.edu

Dr. Eduardo Fernandez Martin, BCMaterials, Spain, eduardo.fernandez@bcmaterials.net

Dr. Mark Mascaro, daigohji@alum.mit.edu

Dr. Hayato Miyagawa, Kagawa University, miyagawa@eng.kagawa_u.ac.jp

Dr. Debbie Morecroft, ams OSRAM, Austria

Prof. Chunghee Nam, Hannam University, S. Korea, chnam@hnu.ac.kr

Prof. Dr. Kornelius Nielsch, Institute for Metallic Materials, Dresden, k.nielsch@ifw-dresden.de

Prof. Yongjun Oh, Hanyang, University, Korea,  yjoh@hnu.ac.kr

Dr. Shuchi Ojha, Applied Materials, CA, shuchi@alum.mit.edu

Prof. Mehmet Onbasli, University of Koc, Turkey, monbasli@ku.edu.tr

Dr. David Navas Otero, Univ. Porto, Portugal, dnavas@fc.up.pt

James N. Pacella, jpacella@alum.mit.edu

Dr. Joy C. Perkinson, Draper Laboratory, jperkinson@draper.com

Dr. Andy Quindeau, Alambic Investment Management, CA

Dr. Ashok Rajamani, Intel, Oregon, ashok.rajamani@intel.com

Dr. Hemant Kumar Raut, National University of Singapore, Singapore, hkraut@alum.mit.edu

Carlos Barbero Rodriguez, carlosb@mit.edu

Efrain Rodriguez, efrain@alum.mit.edu

Prof. Lingying Shi, Sichuan University, shilingying@scu.edu.cn

Prof. Mutsuhiro Shima, Gifu Univ., Japan, shimam@gifu_u.ac.jp

Yuh-Jer Shine, yuhjer@yahoo.com

Marianna Shnayderman, mariana1@alum.mit.edu

Dr. Vikram Sivakumar, Intel, OR, svikram@alum.mit.edu

Dr. Jeong Gon Son, Korean Institute of Science and Technology, S. Korea, jgson@kist.re.kr

Dr. Bingqian Song, Harbin Institute of Technology, Heilongjiang Sheng, China, songb6@kaist.ac.kr

Dr. Jeong-Dae Suh, ETRI, Korea, jdsuh@etri.re.kr

Dr. Astera Tang, astera@alum.mit.edu

Alexander R. Taussig, ATaussig@hcp.com

Dr. Tamar Tepper, Rafael, Israel, tamarte@rafael.co.il

Dr. Guo Tian, South China Normal University, Guangdong, China, guotian@m.scnu.edu.cn

Dr. Larysa Tryputen, Researcher, Netherlands, tryputen@alum.mit.edu

Megan Tsai, mstsai@alum.mit.edu

Dr. Kun-Hua Tu, kunhua@alum.mit.edu

Dr. Doug Twisselmann, Netflix, CA

Prof. Juan Manuel Florez Uribe, Federico Santa María Technical University, Chile, juanmanuel.florez@usm.cl

Dr. Bernhard Vogeli, Epispeed, Switzerland, bernhard.vogeli@epispeed.com

Guhua (Andrew) Yao, Corporate Attorney, Morgan Lewis & Bockius Law LLP, CA

Seungha Yoon, NIST, Gaithersburg, seungha.yoon@nist.gov

Dr. Jinshuo Zhang, zhangjs@alum.mit.edu

Liang Zhang, g0601914@alum.mit.edu

Xu (Aaron) Zhang, xu_zhang@alum.mit.edu

Yan Zhang, University of Electronic Science and Technology of China, Chengdu, China