Carlos Barbero Rodriguez, carlosb at mit.edu
Katharina Lasinger, lasingek at mit.edu
Dr. Runze Liu, runzeliu at mit.edu
Dr. Takian Fakhrul
Dr. Sangho Lee, Massachusetts Institute of Technology, shole at mit.edu
Dr. Yabin Fan, yabinfan@mit.edu
Prof. Lingying Shi, Sichuan University, shilingying at scu.edu.cn
Wonmoo Lee, KAIST, Korea, wontauk1526 at kaist.ac.kr
Dr. Astera Tang, astera at mit.edu
Dr. Li Chen Cheng, Lam Research, cliches at mit.edu
Dr. Hemant Kumar Raut, National University of Singapore, Singapore, hkraut at mit.edu
Dr. Bingqian Song, Harbin Institute of Technology, Heilongjiang Sheng, China, songb at mit.edu
Dr. Guo Tian, South China Normal University, Guangdong, China, guotian at m.scnu.edu.cn
Yan Zhang, University of Electronic Science and Technology of China, Chengdu, China, yzhang08 at mit.edu
Dr. Shuchi Ojha, shuchi at mit.edu
Dr Kun-Hua Tu, kunhua at mit.edu
Dr Chen Zhang, Shandong University, China, zhangch at mit.edu
Dr Eduardo Fernandez Martin, BCMaterials, Spain, eduardo.fernandez@bcmaterials.net
Dr. Jinshuo Zhang, zhangjs at alum.mit.edu
Dr. Andy Quindeau, andy.quindeau at gmail.com
Dr. Saman Safari Dinachali, safarid at mit.edu
Dr. Enno Lage, University of Kiel, Germany, no at tf.uni-kiel.edu
Dr. Wubin Bai, Postdoc, Northwestern University, wubin.bai at northwestern.edu
Dr. Frank Liu, IBM, frankliu at us.ibm.com
Dr. Pin Ho, Researcher, A-Star, Singapore, hopin at dsa-a-star.edu.sg
Dr. Larysa Tryputen, Researcher, Netherlands, tryputen at mit.edu
Prof. Mehmet Onbasli, University of Koc, Turkey, monbasli at ku.edu.tr
Prof. Jean Anne Currivan Incorvia, University of Texas Austin, incorvia at austin.utexas.edu
Dr. Christine Claudia Kathrein, Univ. Aachen, kathrein at dwi.rwth-aachen.de
Prof. Dong Hun Kim, Myong Ji University, dhkim at mju.ac.kr
Keehong Lee (visiting engineer), Samsung Semiconductor R&D Center, power710.lee at samsung.com
Prof. Hong Kyoon Choi, Kongju Univ., Korea, hkchoi at kongju.ac.edu
Dr. Nicolas Aimon, naimo at alum.mit.edu
Dr. Adam Floyd Hannon, Data Scientist at FraudScope, thefloyd at alum.mit.edu, https://fraudscope.co/
Dr. Jin Young Kim, Korean Institute of Science and Technology, S. Korea, jykim at kist.re.kr
Prof. Taichi Goto, Toyohashi Univ. of Tech., Japan, goto at ee.tut.ac.jp
Dr. Kevin Gotrik, 3M Corp.
Prof. Juan Manuel Florez Uribe, Federico Santa María Technical University, Chile, juanmanuel.florez at usm.cl
Dr. Karim Aissou, École Nationale Supérieure de Chimie et de Physique de Bordeaux, France, Karim.Aissou at enscbp.fr
Dr. Mark Mascaro, daigohji at alum.mit.edu
Seungha Yoon, NIST, Gaithersburg, seungha.yoon at nist.gov
Dr. Jeong Gon Son, Korean Institute of Science and Technology, S. Korea, jgson at kist.re.kr
Dr. Peng Jiang, peng0469 at mit.edu
Dr. Youngman Jang, Samsung, S. Korea, youngman.jang at samsung.com
Prof. Lei Bi, University of Electronic Science and Technology of China, Chengdu, bilei at uestc.edu.cn
Prof. Chunghee Nam, Hannam University, S. Korea, chnam at hnu.ac.kr
Prof. Carlos Garcia, Universidad Tecnica Federico Santa Maria, Chile, carlos.garcia at usm.cl
Dr. Vivian Chuang, Apple, CA
Prof. Yeon Sik Jung, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, ysjung at kaist.ac.kr
Prof. Hyunsuk Kim, Department of Materials Science and Engineering, ChungNam National University, Korea, khs3297 at cnu.ac.kr
Dr. David Navas Otero, Univ. Porto, Portugal, dnavas at fc.up.pt
Prof. Yongjun Oh, Hanyang, yjoh at hnu.ac.kr
Dr. Hayato Miyagawa, Kagawa University, miyagawa at eng.kagawa_u.ac.jp
Dr. Fernando Castaño, Siliken, Valencia, Spain, fernando.castano at siliken.com
Dr. Vikram Sivakumar, Intel, OR, svikram at alum.mit.edu
Bryan Ng, bng at alum.mit.edu
Dr. Filip Ilievski, Philips Lumileds Lighting Co, Filip.Ilievski at philips.com
Lei Du
James N. Pacella, jpacella at alum.mit.edu
Alexander R. Taussig, ATaussig at hcp.com
Dr. Wonjoon Jung, Seagate, Minnesota, wonjoon.jung at seagate.com
Irénée Colin, irenee at alum.mit.edu
Xiaoyan (Cherie) Chen, xychen at alum.mit.edu
Xu (Aaron) Zhang, xu_zhang at alum.MIT.EDU
Joy C. Perkinson, Draper Laboratory, jperkinson at draper.com
Liang Zhang, g0601914 at alum.MIT.EDU
Dr. Jeong-Dae Suh, ETRI, Korea, jdsuh at etri.re.kr
Guhua Yao, Foley & Lardner LLP, Palo Alto
Dr. Elizabeth Friend, Unity Semiconductor, CA, efriend at unitysemi.com
Dr. Martin Bolduc, Institut National d’Optique, Quebec, Martin.Bolduc at ino.ca
Dr. Debbie Morecroft, Siliken, Spain
Dr. Joy Cheng, TSMC, Taiwan, yrchengb at tsmc.com
Wang Lei, soyegg at alum.mit.edu
Megan Tsai, mstsai at alum.mit.edu
Dr. Ashok Rajamani, Intel, Oregon, ashok.rajamani at intel.com
Marianna Shnayderman, mariana1 at alum.mit.edu
Efrain Rodriguez, efrain at alum.mit.edu
Peter Chambers, U. Pittsburgh
Prof. Dr. Kornelius Nielsch, Institute for Metallic Materials, Dresden, k.nielsch at ifw-dresden.de
Prof. Yaowu Hao, University of Texas at Arlington, yhao at uta.edu
Dr. Tamar Tepper, Rafael, Israel, tamarte at rafael.co.il
Prof. Mutsuhiro Shima, Gifu Univ., Japan, shimam at gifu_u.ac.jp
Susumu Haratani, TDK Japan, shara at mb1.tdk.co.jp
Lexi Ford, UC Berkeley, lexiford at uclink.berkeley.edu
Dr. Bernhard Vogeli, Epispeed, Switzerland, bernhard.vogeli at epispeed.com
Prof. Minha Hwang, McGill University, minha.hwang at mcgill.ca
Dr. Doug Twisselmann, Adelphia, CA, dougsemail at adelphia.net
Dr. Maya Farhoud, Agilent Technology, maya_farhoud at agilent.com
Yuh-Jer Shine, yuhjer at yahoo.com