Dr. Nicolas Aimon, naimo@alum.mit.edu
Dr. Karim Aissou, Institut Europeen des Membranes, Montpellier, France, karim.aissou@umontpellier.fr
Prof. Wubin Bai, University of North Carolina, wbai@unc.edu
Prof. Lei Bi, University of Electronic Science and Technology of China, Chengdu, bilei@uestc.edu.cn
Dr. Martin Bolduc, Varitron, Quebec, mbolduc@varitron.com
Dr. Fernando Castaño, ams OSRAM, Austria, fernando.castano@ams.com
Peter Chambers, U. Pittsburgh
Xiaoyan (Cherie) Chen, xychen@alum.mit.edu
Dr. Joy Cheng, TSMC, Taiwan, yrchengb@tsmc.com
Dr. Li Chen Cheng, Lam Research, li-chen.cheng@lamresearch.com
Dr. Eunsoo Cho, escho@alum.mit.edu
Prof. Hong Kyoon Choi, Kongju Univ., Korea, hkchoi@kongju.ac.edu
Dr. Vivian Chuang, JSR Micro Inc, CA
Irénée Colin, irenee@alum.mit.edu
Dr. Saman Safari Dinachali, safarid@alum.mit.edu
Lei Du
Prof. Takian Fakhrul, Bangladesh University of Engineering and Technology, takianf@mme.buet.ac.bd
Dr. Yabin Fan, Western Digital, CA, yabinfan@wdc.com
Dr. Maya Farhoud, Qorvo Inc., Marin, CA.
Lexi Ford, UC Berkeley
Dr. Elizabeth Friend, Western Digital, CA
Prof. Carlos Garcia, Universidad Tecnica Federico Santa Maria, Chile, carlos.garcia@usm.cl
Prof. Taichi Goto, Tohoku University, Japan, taichi.goto.a6@tohoku.ac.jp
Dr. Kevin Gotrik, 3M Corp., kwgotrik@mmm.com
Dr. Adam Floyd Hannon, Data Scientist, FraudScope, thefloyd@alum.mit.edu
Prof. Yaowu Hao, University of Texas at Arlington, yhao@uta.edu
Susumu Haratani, TDK Japan, shara@mb1.tdk.co.jp
Dr. Pin Ho, Senior Scientist, A*STAR – Agency for Science, Technology and Research, Singapore
Prof. Minha Hwang, Principal Architect, Microsoft, CA
Dr. Filip Ilievski, Technologist, Apple, CA, filip@alum.mit.edu
Prof. Jean Anne Currivan Incorvia, University of Texas Austin, incorvia@austin.utexas.edu
Jaedong Jang, Korea Advanced Institute of Science and Technology (KAIST)
Dr. Youngman Jang, Samsung, S. Korea, youngman.jang@samsung.com
Dr. Peng Jiang, peng0469@alum.mit.edu
Dr. Wonjoon Jung, Western Digital, CA, jungwonjoon@westerndigital.com
Prof. Yeon Sik Jung, Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, ysjung@kaist.ac.kr
Dr. Christine Kathrein, Univ. Aachen
Dr. Bharat Khurana, bkhurana@alum.mit.edu
Prof. Dong Hun Kim, Myong Ji University, Korea. dhkim@mju.ac.kr
Prof. Hyunsuk Kim, Department of Materials Science and Engineering, ChungNam National University, Korea, khs3297@cnu.ac.kr
Dr. Jin Young Kim, Korean Institute of Science and Technology, S. Korea, jinykim@kist.re.kr
Dr. Enno Lage, Signaturexperte Magnetik, Thyssenkrupp, Kiel, Germany
Katharina Lasinger, ETH Zurich, lasingek@mit.edu
Keehong Lee, Samsung Semiconductor R&D Center, power710.lee@samsung.com
Dr. Sangho Lee, Massachusetts Institute of Technology, sholee@mit.edu
Wonmoo Lee, KAIST, Korea, wontauk1526@kaist.ac.kr
Wang Lei, soyegg@alum.mit.edu
Dr. Frank Liu, IBM, frankliu@us.ibm.com
Dr. Runze Liu, runzeliu@alum.mit.edu
Dr. Eduardo Fernandez Martin, BCMaterials, Spain, eduardo.fernandez@bcmaterials.net
Dr. Mark Mascaro, daigohji@alum.mit.edu
Dr. Hayato Miyagawa, Kagawa University, miyagawa@eng.kagawa_u.ac.jp
Dr. Debbie Morecroft, ams OSRAM, Austria
Prof. Chunghee Nam, Hannam University, S. Korea, chnam@hnu.ac.kr
Prof. Dr. Kornelius Nielsch, Institute for Metallic Materials, Dresden, k.nielsch@ifw-dresden.de
Prof. Yongjun Oh, Hanyang, University, Korea, yjoh@hnu.ac.kr
Dr. Shuchi Ojha, Applied Materials, CA, shuchi@alum.mit.edu
Prof. Mehmet Onbasli, University of Koc, Turkey, monbasli@ku.edu.tr
Dr. David Navas Otero, Univ. Porto, Portugal, dnavas@fc.up.pt
James N. Pacella, jpacella@alum.mit.edu
Dr. Joy C. Perkinson, Draper Laboratory, jperkinson@draper.com
Dr. Andy Quindeau, Alambic Investment Management, CA
Dr. Ashok Rajamani, Intel, Oregon, ashok.rajamani@intel.com
Dr. Hemant Kumar Raut, National University of Singapore, Singapore, hkraut@alum.mit.edu
Carlos Barbero Rodriguez, carlosb@mit.edu
Efrain Rodriguez, efrain@alum.mit.edu
Prof. Lingying Shi, Sichuan University, shilingying@scu.edu.cn
Prof. Mutsuhiro Shima, Gifu Univ., Japan, shimam@gifu_u.ac.jp
Yuh-Jer Shine, yuhjer@yahoo.com
Marianna Shnayderman, mariana1@alum.mit.edu
Dr. Vikram Sivakumar, Intel, OR, svikram@alum.mit.edu
Dr. Jeong Gon Son, Korean Institute of Science and Technology, S. Korea, jgson@kist.re.kr
Dr. Bingqian Song, Harbin Institute of Technology, Heilongjiang Sheng, China, songb6@kaist.ac.kr
Dr. Tingyu Su, tingyu@alum.mit.edu
Dr. Jeong-Dae Suh, ETRI, Korea, jdsuh@etri.re.kr
Dr. Astera Tang, astera@alum.mit.edu
Alexander R. Taussig, ATaussig@hcp.com
Dr. Tamar Tepper, Rafael, Israel, tamarte@rafael.co.il
Dr. Guo Tian, South China Normal University, Guangdong, China, guotian@m.scnu.edu.cn
Dr. Larysa Tryputen, Researcher, Netherlands, tryputen@alum.mit.edu
Megan Tsai, mstsai@alum.mit.edu
Dr. Kun-Hua Tu, kunhua@alum.mit.edu
Dr. Doug Twisselmann, Netflix, CA
Prof. Juan Manuel Florez Uribe, Federico Santa María Technical University, Chile, juanmanuel.florez@usm.cl
Dr. Bernhard Vogeli, Epispeed, Switzerland, bernhard.vogeli@epispeed.com
Guhua (Andrew) Yao, Corporate Attorney, Morgan Lewis & Bockius Law LLP, CA
Seungha Yoon, NIST, Gaithersburg, seungha.yoon@nist.gov
Dr. Jinshuo Zhang, zhangjs@alum.mit.edu
Liang Zhang, g0601914@alum.mit.edu
Xu (Aaron) Zhang, xu_zhang@alum.mit.edu
Yan Zhang, University of Electronic Science and Technology of China, Chengdu, China